160x128 OLED, OLED 160x128 - REX160128B
160x128 OLED, OLED 160x128 - REX160128B
160x128 OLED, OLED 160x128 - REX160128B
160x128 OLED, OLED 160x128 - REX160128B
160x128 OLED, OLED 160x128 - REX160128B
160x128 OLED, OLED 160x128 - REX160128B

1.92-inch 160x128 OLED Display Module with CH1120

Model No. REX160128B

REX160128B is a COG 160x128 OLED graphic display. This 1.92-inch OLED has a module size of 34.5×48.8 mm and an active area of 28.908×39.34 mm. Its built-in IC CH1120 supports 3-line/ 4-line SPI, I2C serial communication, and 6800/ 8080 parallel interfaces.

The OLED 160x128 module boasts a high contrast ratio of 10,000:1 and a wide viewing angle compared to traditional LCD screens. The logic voltage range is from 1.65V to 3.5V (typical value: 3V). It can work within temperature -40°C〜+80°C, and its storage temperature ranges from -40°C〜+85°C.

If you require technical support or a product quote for the REX160128B, please feel free to contact our sales team!

Data Source Ref: REX160128BWPP3N00000

Inquiry or Demo Code Datasheet Back Previous Next
  • General Specifications
  • Interface Pin Function
  • Contour Drawing
  • Absolute Maximum Ratings
  • Electrical Characteristics
Item Dimension Unit
Structure COG
Size (Diagonal) 1.92 inch
Dot Matrix / Resolution 160 × 128 dots
Module Dimension 34.5 × 48.8 × 1.41 mm
Viewing Area 30.908 × 41.34 mm
Active Area 28.908 × 39.34 mm
Dot / Pixel Size 0.206 × 0.226 mm
Dot / Pixel Pitch 0.226 × 0.246 mm
Emitting Color OLED, White / Yellow
Display Mode Passive Matrix
IC CH1120
Interface 6800,8080,SPI,I2C
Power Supply 3V
Duty 1/128 Duty
Operating Temperature -40~+80 °C
Storage Temperature -40~+85 °C
Polarizer Type Polarizer Optional
Type OLED Graphic Display
Pin No. Symbol Function
1 NC No connection
2 VPP This is the most positive voltage supply pad of the chip.
It should be supplied externally.
3 VSEGM This is a segment pre-charge voltage.
A capacitor can be connected between this pad and VSS if necessary. When external capacitor Is not used, this pin should be kept NC.
4 VCOMH This is a pad for the voltage output high level for common signals.
A capacitor should be connected between this pad and VSS.
5 VSL Discharge voltage level pad.
This pad should be connected to resistor and diode externally.
6 NC No connection
7 IREF This is a segment current reference pad.
A resistor should be connected between this pad and VSS.
8 VPP This is the most positive voltage supply pad of the chip.
It should be supplied externally.
9 NC No connection
10 VSS Ground for logic and analog. This pad should be connected to GND externally.
11 VCL This is a common voltage reference pad.
This pad should be connected to VSS externally.
12 VDD Power supply for logic and input/output
13 IM0 These are the MPU interface mode select pads.
  8080 3-Wire SPI 4-Wire SPI 6800 I2C
IM0 0 0 0 1 0
IM1 1 0 0 0 1
IM2 1 1 0 0 0
14 IM1
16 IM2
15 VDD Power supply for logic and input/output
17 CSB This pad is the chip select input. When CSB = "L ", then the chip select becomes active, and data command I/O is enabled. When in I2C interface, this pin is not used, so it must be connected to “L”.
18 RESB This is a reset signal input pad. When RESB is set to "L", the settings are initialized. The reset operation is performed by the RESB signal level. This pin internal pull high.
19 A0 This is the Data/Command control pad that determines whether the data bits are data or a command.
A0 = "H": the inputs at D0 to D7 are treated as display data.
A0 = "L": the inputs at D0 to D7 are transferred to the command registers.
In I2C interface, this pad serves as SA0 to distinguish the different address of OLED driver. When in 3-wire interface, this pin is not used, so it must be connected to "L".
20 WRB This is a MPU interface input pad.
When connected to an 8080 MPU, this is active LOW. This pad connects to the 8080 MPU WR signal. The signals on the data bus are latched at the rising edge of the WR signal.
When connected to a 6800 Series MPU: This is the read/write control signal input terminal. When R/W = "H": Read.
When R/W = "L": Write.
When in 3-wire.4-wire & I2C interface, this pin is not used, so it must be connected to “L”.
21 RDB This is a MPU interface input pad.
When connected to an 8080 series MPU, it is active LOW. This pad is connected to the RD signal of the 8080 series MPU, and the data bus is in an output status when this signal is "L".
When connected to a 6800 series MPU, this is active HIGH. This is used as an enable clock input of the 6800 series MPU.
When in 3-wire.4-wire & I2C interface, this pin is not used, so it must be connected to "L" .
22 D0 This is an 8-bit bi-directional data bus that connects to an 8-bit or 16-bit standard MPU data bus.
When the serial interface(SPI) and I2C is selected, then D0 serves as the serial clock input pad (SCL) and D1 serves as the serial data input pad (SI). At this time, D2 to D7 are set to high impedance. D7~D2 is recommended to connect the VDD or GND. It is also allowed to leave D7~D2 unconnected.
23 D1
24 D2
25 D3
26 D4
27 D5
28 D6
29 D7
30 NC No connection
31 VPP This is the most positive voltage supply pad of the chip.
It should be supplied externally.

160x128 OLED, OLED 160x128 - REX160128B Contour Drawing - Raystar

Parameter Symbol Min Max Unit
Supply Voltage for Logic VDD -0.3 3.5 V
Supply Voltage for Display VPP -0.3 15.0 V
Operating Temperature TOP -40 +80 °C
Storage Temperature TSTG -40 +85 °C

DC Electrical Characteristics

Item Symbol Condition Min Typ Max Unit
Supply Voltage for Logic VDD - 1.65 3.0 3.5 V
Supply Voltage for Display VPP - 8.0 12.0 12.5 V
Input High Volt VIH - 0.8xVDD - VDD V
Input Low Volt VIL - VSS - 0.2xVDD V
Output High Volt VOH IOH=-0.5mA 0.8xVDD - VDD V
Output Low Volt VOL IOL=0.5mA VSS - 0.2xVDD V
Display 50% Pixel on IPP VPP=12V - 25 37.5 mA
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