- Especificación
- Función Interfaz Pin
- Dibujo Contorno
- Valores Nominales Máximos Absolutos
- Características Electrónicas
| Elemento | Dimensión | Unidad |
|---|---|---|
| Estructura | COG | |
| Tamaño (Diagonal) | 1.3 | pulgada |
| Matriz de puntos (Resolución) | 64 × 128 | dots |
| Dimensión del módulo | 17.1 × 35.80 × 1.41 | mm |
| Área de visión | 15.3 × 30.02 | mm |
| zona activa(AA) | 14.06 × 29.42 | mm |
| Tamaño del punto | 0.20 × 0.21 | mm |
| Distancia entre puntos | 0.22 × 0.23 | mm |
| Color de Emisión | OLED, Blanco | |
| Admite Escala de Grises | Sí | |
| Modo de visualización | Matriz Pasiva | |
| Escala de Grises | 1 bits (Blanco/Negro) | |
| IC | SH1107 | |
| Interfaz | 4-wire SPI, I2C | |
| Fuente de alimentación | 3V | |
| Deber | 1/64 Duty | |
| Temperatura de funcionamiento | -40~+80 | °C |
| Temperatura de almacenamiento | -40~+85 | °C |
| Tipo | Pantalla Gráfica OLED |
| No. | Símbolo | Función |
|---|---|---|
| 1 | VSS | Ground. |
| 2 | D1 | When the serial interface is selected, then D0 serves as the serial clock input pad (SCL) and D1 serves as the serial data input pad (SI). When the I2C interface is selected, then D0 serves as the serial clock input pad (SCL) and D1 serves as the serial data input pad (SDA). |
| 3 | D0 | |
| 4 | A0 | This is the Data/Command control pad that determines whether the data bits are data or a command. A0 = “H”: Data. A0 = “L”: Command In I2C interface, this pad serves as SA0 to distinguish the different address of OLED driver. |
| 5 | — RES |
This is a reset signal input pad. When RES is set to “L”, the settings are initialized. The reset operation is performed by the RES signal level. |
| 6 | — CS |
This pad is the chip select input. When CS = “L”, then the chip select becomes active, and data/command I/O is enabled. |
| 7 | IREF | This is a segment current reference pad. A resistor should be connected between this pad and VSS. Set the current at 15.625uA. |
| 8 | IM1 | These are the MPU interface mode select pads. IM1 connect to VDD is I2C interface. IM1 connect to VSS is 4-wire SPI interface. |
| 9 | VDD | Power supply for logic and input. |
| 10 | VCOMH | This is a pad for the voltage output high level for common signals. A capacitor should be connected between this pad and VSS. |
| 11 | VPP | This is the most positive voltage supply pad of the chip. It should be supplied externally. |
| 12 | VSS | Ground. |

| Parámetro | Símbolo | Mínimo | Máximo | Unidad |
|---|---|---|---|---|
| Tensión Alimentación para Lógica | VDD | -0.3 | +3.6 | V |
| Tensión de Alimentación de Pantalla | VPP | 7.0 | 17.0 | V |
| Temperatura Funcionamiento | TOP | -40 | +80 | °C |
| Temperatura Almacenamiento | TSTG | -40 | +85 | °C |
Características Electrónicas DCs
| Artículo | Símbolo | Condición | Mínimo | Tipo | Máximo | Unidad |
|---|---|---|---|---|---|---|
| Tensión Alimentación para Lógica | VDD | - | 1.65 | 3.3 | 3.5 | V |
| Tensión de Alimentación de Pantalla | VPP | - | 7.0 | 13.0 | 13.5 | V |
| Voltaje Alto Entrada | VIH | - | 0.8×VDD | - | VDD | V |
| Voltaje Bajo Entrada | VIL | - | VSS | - | 0.2×VDD | V |
| Voltaje Alto Salida | VOH | - | 0.8×VDD | - | VDD | V |
| Voltaje Bajo Salida | VOL | - | VSS | - | 0.2×VDD | V |
| Display 50% Pixel on | IPP | VPP=13V | - | 10 | 15 | mA |












